| 摘要 |
PROBLEM TO BE SOLVED: To efficiently manufacture an electronic component small in dispersion of length of a folded-back part of an external electrode from an end face to a side face of an electronic component element, thickness of an end face part and the like, and high in dimensional accuracy. SOLUTION: The tool 3 for holding an electronic component element on which an adhesive layer 2 having a central part 2a thicker than peripheral parts 2b is arranged on a base member 1 is used; a solvent is supplied to the central part of the adhesive part to swell the adhesive layer to bring the thickness of the central part close to that of the peripheral part; respective one-side end faces 11a of a plurality of electronic component elements 11 are stuck to the swollen adhesive layer to hold the plurality of electronic component elements to the adhesive layer; and in that state, the other-side end faces 11b of the electronic component elements are immersed in paste (conductive paste) 15 to stick the paste to the other end faces of the electronic component elements. When the solvent is supplied to the central region of the adhesive layer to swell the adhesive layer, the adhesive layer is swollen by supplying the solvent to the central part of the adhesive layer by wiping the central part of the adhesive layer with a cloth material soaked with the solvent. COPYRIGHT: (C)2010,JPO&INPIT
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