发明名称 PATCH PACKAGE STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a patch package structure which includes a patch having a weakening line, in which the patch can be easily taken out of the package and comfortably used. Ž<P>SOLUTION: The patch package structure which includes: a package including a first sheet material which is planar and a second sheet material which has been molded, a peripheral area of the first sheet material having been sealed to a peripheral area of the second sheet material to constitute the package, and a patch disposed in the package; in which the patch includes a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner which protects the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer, the release liner having a weakening line for assisting a removal of the release liner; and in which the second sheet material has specific first protrudent part, second protrudent part, third protrudent part and elevated part in a central area thereof except the peripheral area thereof. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010142524(A) 申请公布日期 2010.07.01
申请号 JP20080324884 申请日期 2008.12.22
申请人 NITTO DENKO CORP 发明人 OKADA KATSUHIRO;IWAO YOSHIHIRO;MATSUOKA KENSUKE
分类号 A61F13/02 主分类号 A61F13/02
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