发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device preventing a stress concentration to the bent position of a wiring layer at the corner of a resin post to suppress exfoliations and cracks in the interface between structures and the wiring layer, and improving a mechanical strength of the wiring layer. Ž<P>SOLUTION: The semiconductor device 1A (1) includes: a semiconductor substrate 2 comprising an electrode 3 on at least one surface; an insulating resin layer 4 arranged so as to cover the one surface of the semiconductor substrate; a projection structure 5 arranged on the insulating resin layer and with its top part formed as flat part 5a; a first conductive layer 6a arranged on the insulating resin layer and with its one end part electrically connected to the electrode; a second conductive layer 6b arranged on the flat part of the structure; a third conductive layer 6c linearly arranged on the side part 5b of the structure and electrically connecting the other end part of the first conductive layer and the second conductive layer; and a first reinforcing layer 7 provided so as to cover their first border part 5c straddling the flat part and the side part of the structure. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010147319(A) 申请公布日期 2010.07.01
申请号 JP20080324144 申请日期 2008.12.19
申请人 FUJIKURA LTD 发明人 ISHIZUKA TAKESHI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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