METHOD FOR PRODUCING MULTILAYER WIRING SUBSTRATE

摘要

A method for producing a multilayer wiring substrate, which comprises the following steps (A) to (F): (A) forming an insulating layer on the surface of a substrate on which an electrically conductive part is formed; (B) partially removing the insulating layer by means of a laser or a drill to form via holes; (C) subjecting the surface on which the via holes have been formed in step (B) to a de-smear treatment to remove residues of the insulating layer which remain on the bottoms of the via holes; (D) forming a resin layer on the surface which has been subjected to the de-smear treatment in step (C) using a resin having a functional group capable of interacting with a plating catalyst element and a polymerizable group; (E) applying a processing solution to the resin layer formed in step (D) to remove parts of the resin layer which lie on the bottoms of the via holes; and (F) applying a plating catalyst to the remaining parts of the resin layer and subsequently carrying out a plating procedure.