发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING RECESS CHANNEL
摘要 <p>PURPOSE: A method for manufacturing a semiconductor device with a recess channel is provided to improve a refresh property by including a bottom protrusion of a fin structure and a bulb recess trench. CONSTITUTION: An upper trench is formed by etching the exposed part of a semiconductor substrate. A silicon nitride layer is formed on the sidewall of the upper trench as an etching barrier layer to block a sidewall and expose the bottom of the upper trench. A bulb recess trench including the upper trench and the lower trench is formed. A bottom protrusion(165) of a fin structure including an upper surface(155) and a side surface is formed by etching a device isolation layer to have a lower surface than the bottom of the lower trench. A gate stack is overlapped with the bulb recess trench and the bottom protrusion.</p>
申请公布号 KR20100073904(A) 申请公布日期 2010.07.01
申请号 KR20080132694 申请日期 2008.12.23
申请人 HYNIX SEMICONDUCTOR INC. 发明人 LEE, JIN YUL;CHOI, BONG HO;CHAE, KWANG KEE;KIM, DONG SEOK;YU, JAE SEON;KIM, HYUNG HWAN;LEE, JAE KYUN
分类号 H01L21/336;H01L29/78 主分类号 H01L21/336
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