发明名称 MULTI-FUNCTION MODULE
摘要 An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.
申请公布号 US2010167557(A1) 申请公布日期 2010.07.01
申请号 US20080345536 申请日期 2008.12.29
申请人 VIRTIUM TECHNOLOGY, INC. 发明人 HOANG PHAN
分类号 H01R12/00;G06F17/50 主分类号 H01R12/00
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