发明名称 CLAMPING DEVICE WITH SPUTTER ADHESION PREVENTION MECHANISMS AND METHOD OF PREVENTING SPUTTER ADHESION
摘要 <p><P>PROBLEM TO BE SOLVED: To effectively discharge sputters caused from a workpiece without directly blowing gas to a laser welding place. <P>SOLUTION: A clamping device 10a with a sputter adhesion prevention mechanism has a device body 12, an opening 14, a first fluid lead-out part 16, and a second fluid lead-out part 18. The sputters 30 are discharged by compressed gas 32 flowing into the opening 14 from the first fluid lead-out part 16. In addition some sputters 30 that are not discharged by the gas 32 are discharged by generating turbulent flow 34 with the other fluid different from the compressed gas 32 and leading out the sputters 30 to the opening 14. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010142827(A) 申请公布日期 2010.07.01
申请号 JP20080320690 申请日期 2008.12.17
申请人 HONDA MOTOR CO LTD 发明人 KAMAIKE HIDENARI;TAKAHASHI NAOKI
分类号 B23K26/42;B23K26/14;B23K26/20 主分类号 B23K26/42
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