| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing apparatus and a resin sealing method that can reduce foreign matters in dissolved resin, thus improving the yield of a semiconductor device. Ž<P>SOLUTION: A resin sealing apparatus 1 has cavity sections 17 and 18 formed between upper and lower metal molds 2 and 3 vertically making a pair for resin-sealing a semiconductor chip 41, a pot portion 10 formed at either of the upper and lower metal molds 2 and 3 for supplying dissolved resin, a resin flow passage 14 formed between the upper and lower metal molds 2 and 3 for connecting the cavity sections 17 and 18 and the pot portion 10 communicatively, and a filter 20 prepared in mid-course of this resin passage 14 for eliminating foreign matters contained in the dissolved resin that passes the resin passage 14, wherein the filter 20 is made up of a mesh material. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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