PRODUCTION METHOD OF ELECTRONIC COMPONENT

摘要

<P>PROBLEM TO BE SOLVED: To improve reliability of an electronic component, by preventing penetration of moisture such as plating liquid from around corner portions into the component body. Ž<P>SOLUTION: A production method performs: a via hole member preparation step S2 of preparing a via hole member 10 having a via hole 11 of a size adapted to surround an end surface 2a as viewed from the penetrating direction; a film forming step S3 of forming a conductive paste film 13 by soaking the via hole member 10 in the conductive paste 12; and a first paste layer forming step S4 of forming a first paste layer 16 by adhering the conductive paste film 13 to the end surface 2a. The conductive paste film 13 formed at the film forming step S3 has a thickness gradually increasing from the center toward the outer circumference owing to influence of a surface tension. Forming the first paste layer 16 by adherence of the conductive paste film 13 in that state to the end surface 2a makes it possible to ensure a sufficient thickness of external electrodes 3 and 4 near a curved corner portion 9. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž