| 发明名称 |
ADHESIVE FILM, MULTILAYER CIRCUIT SUBSTRATE, COMPONENT FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE |
| 摘要 |
Disclosed is an adhesive film characterized by containing: a thermosetting resin with a weight-average molecular weight of less than 1000; a film-forming resin; an oligomer compound having a weight-average molecular weight smaller than that of the film-forming resin and having a weight-average molecular weight larger than that of the thermosetting resin; and a flux activation compound. |
| 申请公布号 |
WO2010073583(A1) |
申请公布日期 |
2010.07.01 |
| 申请号 |
WO2009JP07055 |
申请日期 |
2009.12.21 |
| 申请人 |
SUMITOMO BAKELITE CO., LTD.;FUJII, TOMOE;MAEJIMA, KENZOU;KATSURAYAMA, SATORU |
发明人 |
FUJII, TOMOE;MAEJIMA, KENZOU;KATSURAYAMA, SATORU |
| 分类号 |
C09J7/00;C09J133/00;C09J161/04;C09J163/00;C09J171/00;H01L21/60 |
主分类号 |
C09J7/00 |
| 代理机构 |
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代理人 |
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