| 摘要 |
Embodiments relate to a semiconductor technology, and more particularly, to a modeling structure for simulation of a trapezoidal metal line. The modeling structure for simulation of a trapezoidal metal line includes a top step with a width A, a bottom step with a width B, a middle step with a width equal to an average of the width A and the width B, and a total height C, wherein the middle step has a height equal to a value obtainable by subtracting both a height of the top step and a height of the bottom step from the total height C.
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