发明名称 |
Verfahren zum Formen von Verdrahtung und Elektrode |
摘要 |
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively. |
申请公布号 |
DE602004027183(D1) |
申请公布日期 |
2010.07.01 |
申请号 |
DE20046027183T |
申请日期 |
2004.03.25 |
申请人 |
JSR CORP.;SHARP CORP. |
发明人 |
YOKOYAMA, YASUAKI;YONEKURA, ISAMU;SATOH, TAKASHI;WAKASAKI, TAMAKI;TAKEUCHI, YASUMASA;ENDO, MASAYUKI |
分类号 |
C23C18/02;H01B1/22;C23C18/06;C23C18/08;C23C18/10;C23C18/14;H01L21/288 |
主分类号 |
C23C18/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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