发明名称 |
SOCKET FOR CHIP PACKAGE |
摘要 |
PURPOSE: A socket for a chip package is provided to facilitate an assembly by stably accepting a contact pin which is accepted into a supporting plate. CONSTITUTION: A slot(46) is formed at an interval corresponding to a row direction pitch of a connection terminal, and a plate-shaped support plate(45) has grooves(47). The grooves have the thickness corresponding to a longitudinal direction pitch, and the both ends of contact pins(100) are mounted at the upper and lower ends of the grooves. In a laminated member, plural support plates are laminated. The intermediate unit of the contact pint is inserted into the slot, and the upper and lower ends of the contact pin protrude from the upper and lower planes of the laminated member through the grooves.
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申请公布号 |
KR20100073599(A) |
申请公布日期 |
2010.07.01 |
申请号 |
KR20080132314 |
申请日期 |
2008.12.23 |
申请人 |
OKINS ELECTRONICS CO., LTD. |
发明人 |
JUN, JIN GUK;PARK, SUNG KYU;HAM, JONG UK |
分类号 |
H01R13/46;H01R13/10;H01R33/76 |
主分类号 |
H01R13/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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