| 摘要 |
<P>PROBLEM TO BE SOLVED: To highly assure the bonding strength between a protective film and a metallized portion, and to obtain a reliable electronic component and a method of manufacturing the same. <P>SOLUTION: The electronic component includes: a device chip 10; a substrate 2 in which the thickness in a periphery 2a is thinner than the thickness in a mounting surface 2b in which the flip chip bonding of the device chip 10 is performed; a metallized portion 8 which is prepared on the periphery 2a of the substrate 2, and in which the height of a first end surface 8a which is an end surface of a side near the end of the substrate 2 is higher than the height of a second end surface 8b which is an end surface of the opposite side of the first end surface 8a; a sealing portion 14 which consists of solder, contacts with the metallized portion 8, and seals the device chip 10; and a protective film 16 which covers at least a part of the first end surface 8a and the sealing portion 14. In addition a method of manufacturing the same is disclosed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
