| 摘要 |
<P>PROBLEM TO BE SOLVED: To make it possible to directly radiate heat from a radiating board to a first substrate without passing through a second substrate in an electronic device configured by mounting the second substrate on the first substrate, mounting an electronic component on the second substrate and thermally connecting the electronic component and the radiating board on the second substrate. <P>SOLUTION: In the electronic device including the first substrate 10, the second substrate 20 wherein the electronic component 30 is mounted on one surface side and the other surface side is thermally connected to the first substrate 10, and the radiating board 40 arranged on the one surface side of the second substrate 20 and thermally connected to the electronic component 30, an extension part 70 directly thermally connected to the first substrate 10 is formed at the peripheral part of the radiating board 40. The extension part 70 includes projection sections 41, projecting from the peripheral part of the radiating board 40, of which the tip portions are respectively inserted into through holes 21 of the second substrate 20 and exposed to the other surface side of the second substrate 20, and solder portions 50 for thermally connecting the tip portions of the projection sections 41 to the first substrate 10 on the other surface side of the second substrate 20. <P>COPYRIGHT: (C)2010,JPO&INPIT |
