发明名称 WIRING CIRCUIT BOARD AND CONNECTION STRUCTURE THEREFOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of reducing mismatching of impedance between a magnetic head and an external circuit. <P>SOLUTION: A relay flexible wiring circuit board 3 for electrically connecting a suspension substrate 1 having a circuit and an external substrate 2 to each other comprises: a first wiring circuit board 16 electrically connected to the suspension substrate 1 having the circuit; and a second wiring circuit board 17 for electric connecting with the external substrate 2, wherein the first wiring circuit board 16 and second wiring circuit board 17 are electrically connected through a preamplifier 18, and the first wiring circuit board 16 includes a first metal support layer 19, a first base insulating layer 20, a first conductor layer 21, and a first cover insulating layer 22, and is formed in the same layer constitution as the suspension substrate 1 having the circuit. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010147233(A) 申请公布日期 2010.07.01
申请号 JP20080322566 申请日期 2008.12.18
申请人 NITTO DENKO CORP 发明人 KANEKAWA HITONORI;ITOKAWA AKIYOSHI;HIGUCHI NAOTAKA
分类号 H05K1/14 主分类号 H05K1/14
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