发明名称 MOLDING DIE FOR INJECTION MOLDING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent a space of vacuum state from being generated between a cavity and a molding, when releasing an injection molding from a molding die. Ž<P>SOLUTION: A tapered part 106T is provided in an upper end of a straight part 106S of an ejector pin 106, a gas vent 108 is provided on a surface of the straight part 106S, a tapered hole part 103EHT tapered same to the tapered part 106T of the ejector pin 106 is provided in an upper side of an ejection hole 103EH provided in a movable side cavity 103, a reverse bypass hole part 103EHU with a diameter larger than a positioning hole part 103EHI is provided in an under side of the positioning hole part 103EHI of the ejection hole 103EH, and the reverse bypass hole part 103EHU is set to be communicated with the gas vent 108 provided in the ejector pin 106 all the time, at the time of ejection stroke of the ejector pin 106. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010143165(A) 申请公布日期 2010.07.01
申请号 JP20080324998 申请日期 2008.12.22
申请人 CITIZEN ELECTRONICS CO LTD 发明人 WATANABE OSAMU
分类号 B29C45/40;B29C45/34;B29C45/43 主分类号 B29C45/40
代理机构 代理人
主权项
地址