| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide means to suppress damages that a semiconductor element and a circuit board receive at the time of repairing in a semiconductor device, a method of repairing the same, and a method of manufacturing the same. Ž<P>SOLUTION: A semiconductor device includes: a circuit board 1 with an electrode pad 4 formed on the surface; a first thermo-setting resin layer 8 that is formed on the surface of the circuit board 1 and has a component resolved by an acid aqueous solution or an alkaline aqueous solution; a second thermo-setting resin layer 9 that is formed on the first thermo-setting resin layer 8 and has a component solved by ultra-violet rays; and a semiconductor element 13 that is fixed onto the second thermo-setting resin layer 9 and has an external connection terminal 16 joined to the electrode pad 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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