发明名称 |
BACK SIDE ILLUMINATON IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A back side illumination image sensor according to an embodiment includes: a device isolation region and a pixel region that are on a front side of a first substrate; a light sensor and a readout circuit that are on the pixel region; an interlayer dielectric layer and a metal line that are on the front side of the first substrate; a second substrate that is bonded to the front side of the first substrate on which the metal line is formed; a pixel isolating dielectric layer that is on the device isolation region at a back side of the first substrate; and a microlens that is on the light sensor at the back side of the first substrate
|
申请公布号 |
US2010164035(A1) |
申请公布日期 |
2010.07.01 |
申请号 |
US20090640822 |
申请日期 |
2009.12.17 |
申请人 |
KIM MUN HWAN |
发明人 |
KIM MUN HWAN |
分类号 |
H01L31/14;H01L31/02;H01L31/0232;H01L31/18 |
主分类号 |
H01L31/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|