THE PACKAGE OF POWER DEVICE HAVING ENHANCED HEAT DISSIPATION

摘要

PURPOSE: A power device package is provided to effectively prevent generation of a power device by using a small sized heat sink plate and an overheat preventing element which does not require replacement. CONSTITUTION: A signal applying terminal for applying a signal is formed in the adjacent to both sides in a longitudinal direction in a PCB(200). A power device(110) supplies power by being mounted in a specific region of the PCB. A MIT(Metal-Insulator Transition) device(150) controls the heat generation of a power device by being attached to the heat generating part of the power device. A cooling fin(300) is formed in one region of the upper part of the power device.