发明名称 LED PACKAGE, METHOD OF MANUFACTURING LED PACKAGE, BACK LIGHT UNIT AND LIGHTING DEVICE
摘要 PURPOSE: A light emitting diode(LED) package, a method for manufacturing the same, a back light unit, and an illuminating device are provided to ensure wide directional angles by emitting light from a light emitting device through a fluorescent lens to the entire direction. CONSTITUTION: An LED package includes a substrate(10), a light emitting device(14), a transparent lens(16), and a fluorescent lens(18). A pattern electrode(12) is formed on the upper side of the substrate. The light emitting device is arranged on one side of the substrate. The transparent lens surrounds the light emitting device. The fluorescent lens covers the transparent lens.
申请公布号 KR20100073598(A) 申请公布日期 2010.07.01
申请号 KR20080132313 申请日期 2008.12.23
申请人 AMOLEDS CO., LTD. 发明人 KIM, HYUN MIN;HWANG, SEON WOOK;OH, DAE SUNG
分类号 H01L33/48;H01L33/58 主分类号 H01L33/48
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