| 摘要 |
PURPOSE: An apparatus for measuring the thickness of a thin film of a wafer is provided to rapidly measure the thickness of the thin film of the wafer by projecting a light on the thin film of a wafer and collecting the reflected light. CONSTITUTION: A measurement module wafer projects light to a thin film and collects reflected light. A transport unit transfers the measurement module. An image output unit measures the film thickness of a wafer based on the received light through the measurement module. The wafer is placed on a stage. The measurement module comprises a first fixed measurement module(111), a second movable measurement module(112), and a third movable measurement module(113).
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