| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus and a plasma processing method, capable of improving processing accuracy of a workpiece. <P>SOLUTION: A plasma processing apparatus for applying an excitation voltage to a discharge gas to generate plasma and irradiating the plasma to process a workpiece includes: a plasma generating mechanism having an injection port for injecting the plasma toward the workpiece and a suction port for sucking space around the injection port; a movement mechanism for relatively moving the plasma generating mechanism and the workpiece; and a control unit for creating processing schedule data of the workpiece so that the processing of the workpiece is performed based on the processing schedule data, wherein the processing schedule data is at least based on target shape data of the workpiece, shape data before processing of the workpiece, processing quantity data of the plasma generating mechanism, and processing distribution data based on the shape of the workpiece after processing using the plasma generating mechanism. <P>COPYRIGHT: (C)2010,JPO&INPIT |
