发明名称 |
Organosilane polymer with improved gap-filling property for semiconductor device and coating composition using the same |
摘要 |
A polymer for gap-filling in a semiconductor device, the polymer being prepared by polycondensation of hydrolysates of the compound represented by Formula 1, the compound represented by Formula 2, and one or more compounds represented by Formulae 3 and 4: [RO]3Si—[CH2]n—Si[OR]3  (1) wherein n is from 0 to 2 and each R is independently a C1-C6 alkyl group; [RO]3Si—[CH2]nX  (2) wherein X is a C6-C12 aryl group, n is from 0 to 2, and R is a C1-C6 alkyl group; [RO]3Si—R′  (3) wherein R and R′ are independently a C1-C6 alkyl group; and [RO]3Si—H  (4) wherein R is a C1-C6 alkyl group.
|
申请公布号 |
US2010167553(A1) |
申请公布日期 |
2010.07.01 |
申请号 |
US20100659379 |
申请日期 |
2010.03.08 |
申请人 |
WOO CHANG SOO;SUNG HYUN HOO;BAE JIN HEE;UH DONG SEON;KIM JONG SEOB |
发明人 |
WOO CHANG SOO;SUNG HYUN HOO;BAE JIN HEE;UH DONG SEON;KIM JONG SEOB |
分类号 |
H01L21/312;C08G77/12;C08L83/05 |
主分类号 |
H01L21/312 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|