| 摘要 |
Provided is a rolled copper foil or an electrolytic copper foil for an electronic circuit wherein a circuit is formed by etching. The rolled copper foil or the electrolytic copper foil is provided with: a heat-resistant layer, which is formed on the etching surface of the rolled copper foil or the electrolytic copper foil and is composed of zinc, a zinc alloy, and oxide of zinc or an oxide of the zinc alloy; and a nickel or nickel alloy layer, which is formed on the heat-resistant layer and is composed of a metal or an alloy having an etching rate lower than copper. At the time of forming the circuit by etching the copper foil of the copper-plated multilayer board, the target circuit having a uniform circuit width can be formed by eliminating spread etching toward the bottom, a time required for forming the circuit by etching is shortened as much as possible, the thickness of the nickel or nickel alloy layer is reduced as much as possible, discoloration commonly called "burn" is eliminated by suppressing oxidation when heat is further applied, and etching performance is improved and generation of a short-circuit and a circuit width failure is eliminated in pattern etching. |
