发明名称 METHOD OF PATTERNING A METAL ON A VERTICAL SIDEWALL OF AN EXCAVATED FEATURE, METHOD OF FORMING AN EMBEDDED MIM CAPACITOR USING SAME, AND EMBEDDED MEMORY DEVICE PRODUCED THEREBY
摘要 <p>A method of patterning a metal (141, 341, 841) on a vertical sidewall (132, 332, 832) of an excavated feature (130, 330, 830) includes placing a material (350) in the excavated feature such that a portion (435) of the metal is exposed in the excavated feature above the material, etching the exposed portion of the metal away from the vertical sidewall using a first wet etch chemistry, and removing the material from the excavated feature by etching it away using a second wet etch chemistry. The described method may be used to produce a MIM capacitor (800) suitable for an eDRAM device.</p>
申请公布号 WO2010039629(A3) 申请公布日期 2010.07.01
申请号 WO2009US58540 申请日期 2009.09.28
申请人 INTEL CORPORATION;KEATING, STEVEN J.;LINDERT, NICK;RAHHAL-ORABI, NADIA;DOYLE, BRIAN;SURI, SATYARTH;SIVAKUMAR, SWAMINATHAN;JONG, LANA;SHA, LIN 发明人 KEATING, STEVEN J.;LINDERT, NICK;RAHHAL-ORABI, NADIA;DOYLE, BRIAN;SURI, SATYARTH;SIVAKUMAR, SWAMINATHAN;JONG, LANA;SHA, LIN
分类号 H01L21/8242;H01L21/027;H01L27/108 主分类号 H01L21/8242
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