发明名称 WAFER TRANSPORTING SYSTEM, SEMICONDUCTOR FABRICATION PLANT STRUCTURE USING THE SAME AND WAFER TRANSPORTING METHOD
摘要 <p>PURPOSE: A wafer transporting system, a semiconductor fabrication plant structure using the same, and a wafer transporting method are provided to minimize a space for installing semiconductor manufacturing equipment by forming a three dimensional multi-storied structure of a semiconductor fabrication plant. CONSTITUTION: A plurality of processing chamber modules(200) is formed on each layer of a multi-storied structure. An elevation channel(110) transfers vertically a wafer transferring box in which wafers are loaded. A semiconductor fabrication plant structure includes a wafer station(300) in order to load wafer cassettes into the wafer transferring box and unload the wafer cassettes from the wafer transferring box.</p>
申请公布号 KR20100073670(A) 申请公布日期 2010.07.01
申请号 KR20080132398 申请日期 2008.12.23
申请人 HWANG, MOO SUNG;KIM, JONG WOOK;SEO, SANG WON 发明人 HWANG, MOO SUNG;KIM, JONG WOOK;SEO, SANG WON
分类号 H01L21/68;H01L21/677 主分类号 H01L21/68
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