发明名称 |
WAFER TRANSPORTING SYSTEM, SEMICONDUCTOR FABRICATION PLANT STRUCTURE USING THE SAME AND WAFER TRANSPORTING METHOD |
摘要 |
<p>PURPOSE: A wafer transporting system, a semiconductor fabrication plant structure using the same, and a wafer transporting method are provided to minimize a space for installing semiconductor manufacturing equipment by forming a three dimensional multi-storied structure of a semiconductor fabrication plant. CONSTITUTION: A plurality of processing chamber modules(200) is formed on each layer of a multi-storied structure. An elevation channel(110) transfers vertically a wafer transferring box in which wafers are loaded. A semiconductor fabrication plant structure includes a wafer station(300) in order to load wafer cassettes into the wafer transferring box and unload the wafer cassettes from the wafer transferring box.</p> |
申请公布号 |
KR20100073670(A) |
申请公布日期 |
2010.07.01 |
申请号 |
KR20080132398 |
申请日期 |
2008.12.23 |
申请人 |
HWANG, MOO SUNG;KIM, JONG WOOK;SEO, SANG WON |
发明人 |
HWANG, MOO SUNG;KIM, JONG WOOK;SEO, SANG WON |
分类号 |
H01L21/68;H01L21/677 |
主分类号 |
H01L21/68 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|