| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an extremely easy and rational novel ultrasonic bonding method in which a bonding unit having a capillary fitted atop of a horn for transmitting vibrations of an ultrasonic vibrator is used, a wire is inserted into a through hole of the capillary, and two members to be bonded are subjected to first bonding processing and second bonding processing to be wired, and to provide an ultrasonic bonding apparatus which has superior operability, is applied with a conventional bonding method as it is and also reduced in manufacturing cost by enhancing the bondability of bonding processing and also improving the quality, and applying the ultrasonic bonding method to the ultrasonic bonding apparatus. <P>SOLUTION: The bonding unit 10b for substrate formation is used in a preprocess of the bonding processing, and surface processing by application of an ultrasonic wave is carried out on the members to be bonded. <P>COPYRIGHT: (C)2010,JPO&INPIT |
