发明名称 MANUFACTURING METHOD AND STRUCTURE OF LIGHT-EMITTING DIODE WITH MULTILAYERED OPTICAL LENS
摘要 A manufacturing method and a structure of a light-emitting diode (LED) with a multilayered optical lens are provided. The manufacturing method includes the steps of: providing an LED chip; forming at least one inner protective layer covering the LED chip and its wire connecting points; and forming an outer protective layer covering the inner protective layer. Both the inner and outer protective layers are optical resin layers while the inner protective layer is harder than the outer protective layer. The structure of the LED includes: an LED chip; at least one inner protective layer covering the LED chip and its wire connecting points; and an outer protective layer covering the said inner protective layer. The relatively hard said inner protective layer can resist external force transmitted by the outer protective layer and protect the LED chip and its wire connecting points from damage by the external force.
申请公布号 US2010163909(A1) 申请公布日期 2010.07.01
申请号 US20070664061 申请日期 2007.09.27
申请人 CHEN MING-HUNG;WEN SHIH-YI;LIN HSIN-TAI 发明人 CHEN MING-HUNG;WEN SHIH-YI;LIN HSIN-TAI
分类号 H01L33/00;H01L33/54;H01L33/56 主分类号 H01L33/00
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