| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a recording head by forming an electric connection part while suppressing the enlargement of a process, in a configuration for performing electric connection with the outside at the rear side of a substrate of the recording head. SOLUTION: The electric connection between the top surface side and the rear surface side of the substrate 10 is established by forming a perforation 20 and arranging a projecting electrode 23 therein. By this, basically, only the process for forming the perforation 20 suffices for the electrode connection between the top and rear surface sides, and the substantial enlargement of a manufacturing process can be avoided compared with the case of installing an embedded electrode. COPYRIGHT: (C)2010,JPO&INPIT |
