| 摘要 |
A ball-implantation method and a system applying the method are provided. To begin with, solder balls are implanted onto a flux applied to each of the ball pads on a substrate plate. Then, a vibration force of preset magnitude is exerted on the substrate plate, inducing vibration and causing any solder balls that have deviated from positions corresponding to the ball pads exposed from the openings of a solder mask provided on the substrate plate to return to the correct orientation and be kept therein by the vibration force and gravity. Subsequently, the ball implantation process is completed using a reflow process to solder the implanted solder balls. Using this method and the system thereof, the problem of missing or misaligned solder balls that occurs after the reflow process is solved, thereby dispensing with rework and improving the production yield and product reliability.
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