CHIP-ON-BOARD LED PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a chip-on-board LED package that comprises: a metallic heatsink plate; a chip mounted on the metallic heatsink plate; phosphors applied on the chip; and a heatsink insulator provided on the metallic heatsink plate, and including a lead electrode therein that is electrically connected to the chip and passes through the heatsink insulator. Therefore, the chip-on-board LED package has improved heatsink performance, thereby realizing a high-luminance LED.