A bonding inspection structure is provided. The bonding inspection structure includes at least a elastic bump located on a substrate. At least an opening is formed in the top portion of the elastic bump. An inspection area of the top portion of the elastic bump is larger than an area of the opening.
申请公布号
US2010163869(A1)
申请公布日期
2010.07.01
申请号
US20090431766
申请日期
2009.04.29
申请人
TAIWAN TFT LCD ASSOCIATION;CHUNGHWA PICTURE TUBES, LTD.;AU OPTRONICS CORPORATION;HANNSTAR DISPLAY CORPORATION;CHI MEI OPTOELECTRONICS CORPORATION;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
