发明名称 SOLDERING IRON FOR USE IN TRANSFER SOLDERING
摘要 PROBLEM TO BE SOLVED: To provide a soldering iron for use in transfer soldering, that solders pin-shaped terminals with no problem even if there is a barrier such as a wall in the row direction of the pin-shaped terminals to be soldered. SOLUTION: A terminal receiving groove 39, through which a pin-shaped terminal 38 passes during transfer soldering, is formed on the surface 35 of the solder tip 23 of a soldering iron 22 so as to traverse the tip surface 35 in the transfer direction of the soldering iron 22, and a solder feeding groove 40 for feeding a molten solder to the terminal receiving groove 39 is formed in the direction crossing the terminal receiving groove 39 so as to traverse the top surface 35. A solder melting groove 42 is formed at one end of the solder feeding groove 40 with which a tip of a thread solder 24 is brought into abutment for melting. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147255(A) 申请公布日期 2010.07.01
申请号 JP20080322978 申请日期 2008.12.18
申请人 JAPAN UNIX CO LTD;TOKAI RIKA CO LTD 发明人 SHINTANI GENKEI;MURASE YUKIHIKO;TSUJI HIRONOBU;KONDO NORIHIRO
分类号 H05K3/34;B23K1/00;B23K3/02;B23K101/42 主分类号 H05K3/34
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