THERMOELECTRIC COOLER OF FLIP-CHIP SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a cooler using a thermoelectric structure and through-hole silicon vias (TSVs). SOLUTION: The thermoelectric structure for cooling an integrated circuit (IC) chip includes: a first-type superlattice layer that is connected to a first voltage and is formed at the top of an IC chip; and a second-type superlattice layer that is connected to a second voltage and is formed at the bottom of the IC chip, the second voltage being different from the first voltage, wherein an active conducting current flows into the first-type and second-type superlattice layers to cool the IC chip. COPYRIGHT: (C)2010,JPO&INPIT