发明名称 PLASMA CVD APPARATUS, METHOD FOR FORMING THIN FILM AND SEMICONDUCTOR DEVICE
摘要 A plasma CVD apparatus including a reaction chamber including an inlet for supplying a compound including a borazine skeleton, a feeding electrode, arranged within the reaction chamber, for supporting a substrate and being applied with a negative charge, and a plasma generating mechanism, arranged opposite to the feeding electrode via the substrate, for generating a plasma within the reaction chamber. A method forms a thin film wherein a thin film is formed by using a compound including a borazine skeleton as a raw material, and a semiconductor device includes a thin film formed by such a method as an insulating film. The apparatus and method enable to produce a thin film wherein low dielectric constant and high mechanical strength are stably maintained for a long time and insulating characteristics are secured.
申请公布号 US2010164072(A1) 申请公布日期 2010.07.01
申请号 US20070294645 申请日期 2007.03.23
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 KUMADA TERUHIKO;NOBUTOKI HIDEHARU;YASUDA NAOKI
分类号 H01L23/58;H01L21/471 主分类号 H01L23/58
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