发明名称 |
PHOTOSENSITIVE ADHESIVE |
摘要 |
Disclosed is an alkali-developable photosensitive adhesive which exhibits adhesion to an object to be bonded even after the adhesive is patterned by exposure and development. Specifically disclosed is a photosensitive adhesive to be used in a method for producing a semiconductor device which method comprises a step wherein a photosensitive adhesive (1) provided on a circuit surface of a semiconductor chip (20) is patterned by exposure and development, and a step wherein another semiconductor chip (21) is directly bonded to the patterned photosensitive adhesive (1). |
申请公布号 |
KR20100074296(A) |
申请公布日期 |
2010.07.01 |
申请号 |
KR20107011104 |
申请日期 |
2008.12.02 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
MASUKO TAKASHI;KAWAMORI TAKASHI;MITSUKURA KAZUYUKI;KATOGI SHIGEKI |
分类号 |
C09J5/00;C09J11/06;C09J179/08;H01L21/58 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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