| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for securely inserting a semiconductor wafer into a holding hole and safely performing polishing at the time of automatically polishing the wafer. <P>SOLUTION: A method detects a position of the holding hole 5 of a carrier 4 holding the wafer used when a double face polishing device polishes the semiconductor wafer. A picture processing means picture-processes data obtained by two picture detecting means 20a and 20b installed to form a prescribed center angle θ with respect to the holding hole. Two points on a boundary of the holding hole and polishing cloth 37b are detected, and the center position of the holding hole is calculated based on the detected two points and the center angle. Thus, the position of the holding hole is detected. A conveyance means sets the semiconductor wafer in the holding hole based on the detected position of the holding hole, and the wafer is polished. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
