发明名称 |
Transfer material, method for producing the same and wiring substrate produced by using the same |
摘要 |
<p>A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer 101 as a carrier, a second metal layer 103 that is transferred to the substrate as a wiring pattern, and a peel layer 102 adhering the first and second metal layers releasably. On the surface portion of the first metal layer 101, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer 102 and the second metal layer 103 are formed on a region of the convex portions.
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申请公布号 |
EP1933376(A3) |
申请公布日期 |
2010.06.30 |
申请号 |
EP20080153272 |
申请日期 |
2001.02.09 |
申请人 |
PANASONIC CORPORATION |
发明人 |
SUGAYA, YASUHIRO;KOMATSU, SHINGO;HIRANO, KOICHI;NAKATINI, SEIICHI;MATSUOKA, YASUYUKI;ASAHI, TOSHIYUKI;YAMASHITA, YOSHIHISA |
分类号 |
H01L21/48;H05K1/03;H05K1/16;H05K3/02;H05K3/20;H05K3/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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