发明名称 |
Encapsulated microelectronic SMD component, especially for an active implantable medical device and method for its manufacture |
摘要 |
To form a casing, on a part of trenches (22) a periphery, of a chip is formed. Electric connections (26) are formed on the top face of the casing. A resin of a coating (34) fills cavity of a trench. The coating is then polished to form a flat cover and a thus prepared wafer is cut into individual components. An Independent claim is included for: (a) a CMC element with a coated chip |
申请公布号 |
EP1011133(B1) |
申请公布日期 |
2010.06.30 |
申请号 |
EP19990403134 |
申请日期 |
1999.12.14 |
申请人 |
ELA MEDICAL;TRONIC'S MICROSYSTEMS |
发明人 |
VAN CAMPENHOUT, YVES;GILET, DOMINIQUE;LEGAY, THIERRY;BONO, HUBERT |
分类号 |
H01L21/56;H01L23/12;H01L21/301;H01L23/31;H01L29/06 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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