发明名称 ELECTRIC MEMORY MODULE WITH COOLING BODIES
摘要 An electric memory module is disclosed with at least two capacitors that are interconnected by an electrically conductive connection device. The memory module includes an electric insulation which electrically insulates the memory module, and the memory module includes a cooling body. According to at least one embodiment of the invention, the cooling body forms the connecting device and the electric insulation is applied to the outside of the cooling body.
申请公布号 IL202531(D0) 申请公布日期 2010.06.30
申请号 IL20090202531 申请日期 2009.12.06
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人
分类号 H01G 主分类号 H01G
代理机构 代理人
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