发明名称 Solder bath and method of heating solder contained in a solder bath
摘要 A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member.
申请公布号 EP2202022(A1) 申请公布日期 2010.06.30
申请号 EP20090252889 申请日期 2009.12.23
申请人 SENJU METAL INDUSTRY CO., LTD 发明人 SATO, ISSAKU;TAKAGUCHI, AKIRA
分类号 B23K3/06;B23K1/08 主分类号 B23K3/06
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