发明名称 |
Solder bath and method of heating solder contained in a solder bath |
摘要 |
A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member.
|
申请公布号 |
EP2202022(A1) |
申请公布日期 |
2010.06.30 |
申请号 |
EP20090252889 |
申请日期 |
2009.12.23 |
申请人 |
SENJU METAL INDUSTRY CO., LTD |
发明人 |
SATO, ISSAKU;TAKAGUCHI, AKIRA |
分类号 |
B23K3/06;B23K1/08 |
主分类号 |
B23K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|