FLUID REFLOW METHOD

摘要

PURPOSE: A liquid reflow method is provided to increase a solder bump by buoyancy inside a liquid bath by performing the reflow after the substrate is immerged in the liquid bath. CONSTITUTION: A substrate with a circuit pattern and a pad(103) is provided. A mask exposing only pad is located on the upper side of the mask. A solder paste is printed on the pad. The substrate is immersed in a liquid path(120a). The reflow is performed inside the liquid bath. A solder paste of the substrate is changed into a solder bump(140).