发明名称 Structural health monitoring (SHM) transducer assembly and system
摘要 A transducer assembly may include a first layer of dielectric material and a pair of electrically conductive traces adjacent to the first dielectric layer. Each of the electrically conductive traces may include a first contact pad and a second contact pad. The first layer of dielectric material may include a pair of vias or openings formed therein to expose each of the first contact pads. A second layer of dielectric material may be attached to the first layer of dielectric material with the pair of electrically conductive traces disposed between the first and second layers of dielectric material. A transducer may be attached to the second layer of dielectric material and each second contact pad may be electrically connected to the transducer.
申请公布号 US7743659(B2) 申请公布日期 2010.06.29
申请号 US20070754167 申请日期 2007.05.25
申请人 THE BOEING COMPANY 发明人 KEARNS JUSTIN D.;ANDERSON DAVID M.
分类号 G01N29/24 主分类号 G01N29/24
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