发明名称 MEMS device having support structures configured to minimize stress-related deformation and methods for fabricating same
摘要 Embodiments of MEMS devices include a movable layer supported by overlying support structures, and may also include underlying support structures. In one embodiment, the residual stresses within the overlying support structures and the movable layer are substantially equal. In another embodiment, the residual stresses within the overlying support structures and the underlying support structures are substantially equal. In certain embodiments, substantially equal residual stresses are be obtained through the use of layers made from the same materials having the same thicknesses. In further embodiments, substantially equal residual stresses are obtained through the use of support structures and/or movable layers which are mirror images of one another.
申请公布号 US7747109(B2) 申请公布日期 2010.06.29
申请号 US20060506594 申请日期 2006.08.18
申请人 QUALCOMM MEMS TECHNOLOGIES, INC. 发明人 ZHONG FAN;KOGUT LIOR
分类号 G02F1/01 主分类号 G02F1/01
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