发明名称 |
Semiconductor package including connector disposed in troughhole |
摘要 |
A semiconductor package and a method of fabricating the same are provided. The semiconductor package includes a semiconductor chip and a circuit board. The semiconductor chip has a bond pad. The circuit board has a base substrate with a throughole, and a conductive film pattern placed on a sidewall of the throughole. The throughole is aligned with the bond pad to expose the bond pad. A connector located within the throughole electrically connects the conductive film pattern to the bond pad. A sealing layer covers the connector.
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申请公布号 |
US7745907(B2) |
申请公布日期 |
2010.06.29 |
申请号 |
US20070764072 |
申请日期 |
2007.06.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JONG-HO;KIM YOUNG-LYONG |
分类号 |
H01L29/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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