发明名称 |
Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the same |
摘要 |
Provided are a semiconductor package and a semiconductor package module including the same. The semiconductor package may include a plurality of semiconductor chips, a plurality of leads connected to pads of the semiconductor chips and externally exposed, wherein the plurality of leads may be classified into a plurality of pin groups, and the plurality of semiconductor chips may be classified into a plurality of chip groups, and the pads of the semiconductor chips of like chip groups may be connected to the leads of like pin groups.
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申请公布号 |
US7745932(B2) |
申请公布日期 |
2010.06.29 |
申请号 |
US20080153558 |
申请日期 |
2008.05.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO JUN-YOUNG;CHAN DAE-SANG;PARK JAE-YONG;KIM HEUI-SEOG;SIN WHA-SU |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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