发明名称 Printed circuit board having capacitor and manufacturing method thereof
摘要 <p>Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C).</p>
申请公布号 KR100966638(B1) 申请公布日期 2010.06.29
申请号 KR20080027551 申请日期 2008.03.25
申请人 发明人
分类号 H05K1/18 主分类号 H05K1/18
代理机构 代理人
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