发明名称 |
Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same |
摘要 |
An electronic device having a bonding pad structure and a method of fabricating the same is provided. The electronic device may include a first bonding pads formed on the substrate. A second bonding pad may be formed on the lower insulating layer. The second bonding pads may be spaced apart from the first bonding pads. The second bonding pads may have a top surface formed at a higher level than the first bonding pads.
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申请公布号 |
US7745255(B2) |
申请公布日期 |
2010.06.29 |
申请号 |
US20080010807 |
申请日期 |
2008.01.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JAE-HYUN;PARK HYUNG-MOO |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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