VACUUM ADSORPTION PICKER TEST FOR SEMICONDUCTOR PACKAGE USING EJECTPIN

摘要

PURPOSE: A vacuum absorption picker for testing a semiconductor package using eject-pins is provided to improve the operational efficiency of the vacuum absorption picker by forming the eject-pins in vacuum holes in a blade shaft and the vacuum pad. CONSTITUTION: In a blade block(100), a blade shaft is installed in vacuum holes and is upwardly protruded. A vacuum pad in a pipe shape is combined to the lower side of the blade shaft. When a vacuum pressure is applied to the vacuum holes, the vacuum pad absorbs a semiconductor package. A blade(300) is assembled to the lower side of the blade block. A combination hole is arranged on the center of the blade.